spec no: dsaa5031 rev no: v.4 date: mar/14/2005 page: 1 of 4 approved: j. lu checked: allen liu drawn: w.j.zhu kpc - 3216mgc mega green description the mega green source color devices are made with dh ingaalp on gaas substrate light emitting diod e. package dimension s 3.2x1.6mm smd chip led lamp features 3.2x1.6mm smt led, 1.1mm thickness. low power consumption. w ide view ing angle. ideal for backlight and indicator. various colors and lens types available. package: 2000pcs / reel . notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0 .2(0.0079") unless otherwise noted. 3.specifications are subject to change without notice.
spec no: dsaa5031 rev no: v.4 date: mar/14/2005 page: 2 of 4 approved: j. lu checked: allen liu drawn: w.j.zhu part no. dice lens type iv (mcd) @ 20 ma viewing angle min. typ. 2 ? 1/2 kpc - 3216mgc mega green (ingaalp) water clear 18 70 120 selection guid e note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. electrical / optical characteristics at t a =25 c absolute maximum ratings at t a =25 c symbol parameter device typ. max. test conditions units peak peak wavelength mega green 574 nm i f =20ma d dominant wavelength mega green 568 nm i f =20ma ? 1/2 spectral line half - width mega green 26 nm i f =20ma c capacitance mega green 20 pf v f =0v;f=1mhz v f forward voltage mega green 2.1 2.5 v i f =20ma i r reverse current mega green 10 ua v r = 5v parameter mega green units power dissipation 105 mw dc forward current 30 ma peak forward current [1] 150 ma reverse voltage 5 v operating/storage temperature - 40c to +85c notes: 1. 1/10 duty cycle, 0.1ms pulse width.
spec no: dsaa5031 rev no: v.4 date: mar/14/2005 page: 3 of 4 approved: j. lu checked: allen liu drawn: w.j.zhu mega green kpc - 3216mgc
spec no: dsaa5031 rev no: v.4 date: mar/14/2005 page: 4 of 4 approved: j. lu checked: allen liu drawn: w.j.zhu recommended soldering pattern (units : mm ) tape specifications (units : kpc - 3216mgc smt reflow soldering instruction s number of reflow process shall be 2 times or less and cooling process to normal temperature is required between first and second soldering process. remarks: if special sorting is required (e.g. binning based on forward voltage,luminous intensity, or wavelength), the typical accuracy of the sorting process is as follows: 1. wavelength: +/ - 1nm 2. luminous intensity: +/ - 15% 3. forward voltage: +/ - 0.1v note: accuracy may depend on the sorting parameters.
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